Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16120109Application Date: 2018-08-31
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Publication No.: US10763352B2Publication Date: 2020-09-01
- Inventor: Hiroshi Matsuba , Hung Hung , Tatsuya Nishiwaki , Kohei Oasa , Kikuo Aida
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@56158545
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/40

Abstract:
A semiconductor device includes a semiconductor layer of a first conductivity type having first and second surfaces and an impurity concentration distribution in a first direction from the second surface to the first surface, a first semiconductor region of a second conductivity between the semiconductor layer and the first surface, a second semiconductor region of a first conductivity type between the first semiconductor region and the first surface side, a first trench extending from the first surface into the semiconductor layer, a first electrode located in the first trench over a first insulating film and spaced from the first semiconductor region by a first insulating film, a second electrode located in the first trench over a second insulating film, a second trench extending from the first surface into the semiconductor layer and surrounding the first trench, and a third electrode located in the second trench over a third insulating film.
Public/Granted literature
- US20190259871A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-08-22
Information query
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