Invention Grant
- Patent Title: Method for manufacturing a semiconductor device having a Schottky contact
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Application No.: US15040353Application Date: 2016-02-10
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Publication No.: US10763339B2Publication Date: 2020-09-01
- Inventor: Jens Peter Konrath , Ronny Kern , Stefan Krivec , Ulrich Schmid , Laura Stoeber
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4b853f0
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/47 ; H01L21/302 ; H01L21/3065 ; H01L29/06 ; H01L29/40 ; H01L29/66 ; H01L21/02 ; H01L21/285 ; H01L29/16 ; H01L29/161 ; H01L21/04 ; H01L29/20

Abstract:
A semiconductor device includes an n-doped monocrystalline semiconductor substrate having a substrate surface, an amorphous n-doped semiconductor surface layer at the substrate surface of the n-doped monocrystalline semiconductor substrate, and a Schottky-junction forming material in contact with the amorphous n-doped semiconductor surface layer. The Schottky-junction forming material forms at least one Schottky contact with the amorphous n-doped semiconductor surface layer.
Public/Granted literature
- US20160276452A1 Method for Manufacturing a Semiconductor Device Having a Schottky Contact Public/Granted day:2016-09-22
Information query
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