Invention Grant
- Patent Title: Driving substrate
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Application No.: US16153847Application Date: 2018-10-08
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Publication No.: US10763308B2Publication Date: 2020-09-01
- Inventor: Wei-Shih Ni , Tai-Kai Chen , Chia-Hsun Lu
- Applicant: E Ink Holdings Inc.
- Applicant Address: TW Hsinchu
- Assignee: E Ink Holdings Inc.
- Current Assignee: E Ink Holdings Inc.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@65973431
- Main IPC: H01L27/28
- IPC: H01L27/28 ; H01L51/05 ; H01L23/373 ; H01L51/10 ; H01L23/367 ; H01L51/00

Abstract:
A driving substrate includes a substrate, a plurality of active devices, a thermal-conducting pattern layer and a buffer layer. The active devices are separately arranged on the substrate. Each active device includes a gate, a channel layer, a gate insulation layer, a source and a drain. The source and the drain expose a portion of the channel layer to define a channel region. The thermal-conducting pattern layer is disposed on the substrate and includes at least one thermal-conducting body and at least one thermal-conducting pattern connected to the thermal-conducting body. The thermal-conducting pattern corresponds to a location of at least one of the channel region, the channel layer, the gate, the source and the drain and each active device. The buffer layer is disposed on the substrate and covers the thermal-conducting pattern layer, and is located between the thermal-conducting pattern and each active device.
Public/Granted literature
- US20190123108A1 DRIVING SUBSTRATE Public/Granted day:2019-04-25
Information query
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