Invention Grant
- Patent Title: Hybrid FinFET structure
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Application No.: US15990278Application Date: 2018-05-25
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Publication No.: US10763280B2Publication Date: 2020-09-01
- Inventor: Chien-Chen Liu , Guan-Jie Shen , Chia-Der Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/08 ; H01L21/308 ; H01L21/8234 ; H01L29/78 ; H01L27/088 ; H01L21/8238 ; H01L27/092

Abstract:
A semiconductor device includes a first fin field effect transistor (FinFET) device, the first FinFET device including a plurality of fins formed in a substrate, an epitaxial layer of semiconductor material formed on the fins forming non-planar source/drain regions, and a first gate structure traversing across the plurality of fins. The semiconductor device includes a second FinFET device, the second FinFET device including a substantially planar fin formed in the substrate, an epitaxial layer of the semiconductor material formed on the substantially planar fin and forming substantially planar source/drain regions, and a second gate structure traversing across the substantially planar fin.
Public/Granted literature
- US20190006392A1 HYBRID FINFET STRUCTURE Public/Granted day:2019-01-03
Information query
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