Invention Grant
- Patent Title: Systems and methods of operating wire bonding machines including clamping systems
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Application No.: US16243291Application Date: 2019-01-09
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Publication No.: US10763236B2Publication Date: 2020-09-01
- Inventor: Peter J. Klaerner , Jason Fu , Christoph Benno Luechinger
- Applicant: Kulicke and Soffa Industries, Inc.
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spletzer, Sr.
- Main IPC: B23K20/00
- IPC: B23K20/00 ; H01L23/00 ; B23K20/10 ; B23K20/26 ; B23K101/40 ; H01L23/367
Abstract:
A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).
Public/Granted literature
- US20190214363A1 SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CLAMPING SYSTEMS Public/Granted day:2019-07-11
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