Invention Grant
- Patent Title: Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device
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Application No.: US16099651Application Date: 2016-05-11
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Publication No.: US10763190B2Publication Date: 2020-09-01
- Inventor: Nobutake Tsuyuno , Morio Kuwano , Takeshi Tokuyama
- Applicant: Hitachi Automotive Systems, Ltd.
- Applicant Address: JP Hitachinaka-Shi
- Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee Address: JP Hitachinaka-Shi
- Agency: Foley & Lardner LLP
- International Application: PCT/JP2016/063942 WO 20160511
- International Announcement: WO2017/195283 WO 20171116
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/34 ; H01L23/06 ; H01L21/00 ; H01L23/473 ; H01L25/18 ; H01L25/07 ; H05K7/20 ; H01L21/52 ; H01L23/00 ; H02M7/00 ; H02M7/537

Abstract:
Provided is a compact power conversion device which is excellent in liquid tightness and has high reliability of a terminal connection portion. A power conversion device according to the present invention includes: a case that houses a power semiconductor; a flow path forming body that forms a flow path with an outer surface of the case; a first fixing material in contact with a refrigerant flowing in the flow path; and a second fixing material that is in contact with the first fixing material and the flow path forming body and covers a direction of displacement of the case of the first fixing material caused by water pressure.
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