Invention Grant
- Patent Title: Method for recovering carbon-face-polarized silicon carbide substrate
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Application No.: US16562452Application Date: 2019-09-06
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Publication No.: US10763174B2Publication Date: 2020-09-01
- Inventor: Xianfeng Ni , Qian Fan , Wei He
- Applicant: Suzhou Han Hua Semiconductor Co., Ltd
- Applicant Address: CN Suzhou, Jiangsu
- Assignee: SUZHOU HAN HUA SEMICONDUCTOR CO., LTD.
- Current Assignee: SUZHOU HAN HUA SEMICONDUCTOR CO., LTD.
- Current Assignee Address: CN Suzhou, Jiangsu
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@56318f0e
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/306 ; H01L29/20 ; H01L29/66

Abstract:
A method for recovering carbon-face-polarized silicon carbide substrates, including: providing an epitaxial structure, the epitaxial structure includes a carbon-face-polarized silicon carbide substrate to be recovered, as well as a nitrogen-face-polarized gallium nitride buffer layer, a barrier layer and a nitrogen-face-polarized gallium nitride channel layer that are sequentially deposited on the silicon carbide substrate; removing the nitrogen-face-polarized gallium nitride buffer layer, the barrier layer and the nitrogen-face-polarized gallium nitride channel layer by wet etching; and cleaning and blowing dry the carbon-face-polarized silicon carbide substrate.
Public/Granted literature
- US20190393090A1 METHOD FOR RECOVERING CARBON-FACE-POLARIZED SILICON CARBIDE SUBSTRATE Public/Granted day:2019-12-26
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