Invention Grant
- Patent Title: Package structure with inductor and method of forming thereof
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Application No.: US15355008Application Date: 2016-11-17
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Publication No.: US10763164B2Publication Date: 2020-09-01
- Inventor: Chih-Lin Chen , Chung-Hao Tsai , Jeng-Shien Hsieh , Chuei-Tang Wang , Chen-Hua Yu , Chih-Yuan Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/48 ; H01F27/245 ; H01L21/768 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L23/50 ; H01L23/498 ; H01F17/00
Abstract:
A package structure includes a first redistribution layer, a molding material, a semiconductor device and an inductor. The molding material is located on the first redistribution layer. The semiconductor device is molded in the molding material. The inductor penetrates through the molding material and electrically connected to the semiconductor device.
Public/Granted literature
- US20180138126A1 PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF Public/Granted day:2018-05-17
Information query
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