Invention Grant
- Patent Title: Semiconductor processing station
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Application No.: US16159709Application Date: 2018-10-14
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Publication No.: US10763140B2Publication Date: 2020-09-01
- Inventor: Chia-Wei Lu , Hon-Lin Huang , Hung-Chih Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: B05C13/00
- IPC: B05C13/00 ; H01L21/67 ; C23C18/16 ; B05C11/06 ; H01L21/673

Abstract:
A semiconductor processing station including a central transfer chamber, a load lock chamber disposed adjacent to the central transfer chamber, and a cooling stage disposed adjacent to the load lock chamber and the central transfer chamber is provided. The load lock chamber is adapted to contain a wafer carrier including a plurality of wafers. The central transfer chamber communicates between the cooling stage and the load lock chamber to transfer a wafer of the plurality of wafers between the cooling stage and the load lock chamber.
Public/Granted literature
- US20190051545A1 SEMICONDUCTOR PROCESSING STATION Public/Granted day:2019-02-14
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