Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.