Invention Grant
- Patent Title: Process of surface-mounting three-dimensional package structure electrically connected by prepackaged metal
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Application No.: US16472160Application Date: 2017-12-14
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Publication No.: US10763128B2Publication Date: 2020-09-01
- Inventor: Haishen Kong , Yubin Lin , Jinxin Shen , Xinfu Liang , Qingyun Zhou
- Applicant: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Jiangyin, Jiangsu
- Assignee: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO, LTD.
- Current Assignee: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO, LTD.
- Current Assignee Address: CN Jiangyin, Jiangsu
- Agency: Ladas & Parry, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@39ac9628
- International Application: PCT/CN2017/116051 WO 20171214
- International Announcement: WO2018/113574 WO 20180628
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L25/16 ; H01L21/60
Abstract:
The present invention relates to a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal, comprising: taking a metal sheet; punching or etching the metal sheet; packaging a conductive metal-pillar frame; performing windowing and slotting; taking a substrate on which a chip is surface-mounted; fitting the conductive metal-pillar frame; performing packaging and grinding; surface-mounting a passive device; performing plastic packaging and ball-mounting; and performing cutting. The process of the present invention can improve the integration level and the reliability.
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