Invention Grant
- Patent Title: Substrate treatment method for semiconductor device fabrication
-
Application No.: US15624843Application Date: 2017-06-16
-
Publication No.: US10763115B2Publication Date: 2020-09-01
- Inventor: Rama I. Hegde
- Applicant: NXP USA, INC.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/28 ; H01L29/66 ; H01L21/285 ; H01L21/02 ; H01L29/49 ; H01L29/51 ; B81C1/00 ; H01L21/768

Abstract:
A method of removing an oxide layer is provided. A metal layer is deposited over an oxide layer formed at a top surface of a germanium substrate. A metal oxide layer is deposited over the metal layer. The metal oxide layer includes a same metal material as the metal layer. The metal layer and the oxide layer are reacted and combined with the metal oxide layer to form a dielectric layer during an anneal process. During the anneal process, the oxide layer is reacted with the metal layer and removed.
Public/Granted literature
- US20180366330A1 SUBSTRATE TREATMENT METHOD FOR SEMICONDUCTOR DEVICE FABRICATION Public/Granted day:2018-12-20
Information query
IPC分类: