Invention Grant
- Patent Title: Shaped electrodes for improved plasma exposure from vertical plasma source
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Application No.: US16220825Application Date: 2018-12-14
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Publication No.: US10763085B2Publication Date: 2020-09-01
- Inventor: Kallol Bera , Dmitry A. Dzilno , Anantha K. Subramani , John C. Forster , Tsutomu Tanaka
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
Plasma source assemblies comprising an RF hot electrode having a body and at least one return electrode spaced from the RF hot electrode to provide a gap in which a plasma can be formed. An RF feed is connected to the RF hot electrode at a distance from the inner peripheral end of the RF hot electrode that is less than or equal to about 25% of the length of the RF hot electrode. The RF hot electrode can include a leg and optional triangular portion near the leg that extends at an angle to the body of the RF hot electrode. A cladding material on one or more of the RF hot electrode and the return electrode can be variably spaced or have variable properties along the length of the plasma gap.
Public/Granted literature
- US20190189404A1 Shaped Electrodes For Improved Plasma Exposure From Vertical Plasma Source Public/Granted day:2019-06-20
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