Invention Grant
- Patent Title: Inspection method for memory integrity, nonvolatile memory and electronic device
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Application No.: US15981918Application Date: 2018-05-17
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Publication No.: US10762970B2Publication Date: 2020-09-01
- Inventor: Jun-Lin Yeh
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d30535b
- Main IPC: G11C16/34
- IPC: G11C16/34 ; G06F11/10 ; G11C16/04 ; G11C29/52 ; G11C29/02 ; G11C29/04

Abstract:
An inspection method for memory integrity, a non-volatile memory, and an electronic device are provided. The method includes following steps. A threshold voltage of at least one memory cell to-be-inspected in a non-volatile memory is obtained. A data value belonging to the at least one memory cell to-be-inspected is determined by comparing a read voltage and the threshold voltage. When the data value belonging to the at least one memory cell to-be-inspected is determined, a preset voltage is set according to the data value. An offset data value belonging to the at least one memory cell to-be-inspected is obtained by comparing the preset voltage and the threshold voltage of the at least one memory cell to-be-inspected. And, whether the data value and the offset data value belonging to the at least one memory cell to-be-inspected are the same is determined, so as to determine whether an integrity of the memory cell to-be-inspected is defective.
Public/Granted literature
- US20190198122A1 INSPECTION METHOD FOR MEMORY INTEGRITY, NONVOLATILE MEMORY AND ELECTRONIC DEVICE Public/Granted day:2019-06-27
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