Invention Grant
- Patent Title: Systems and methods for improved detector assembly sizing
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Application No.: US16001683Application Date: 2018-06-06
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Publication No.: US10761224B2Publication Date: 2020-09-01
- Inventor: Jean-Paul Bouhnik , Moshe Levy , Omri Warshavski
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: The Small Patent Law Group LLC
- Agent Dean D. Small
- Main IPC: G01T1/161
- IPC: G01T1/161 ; G01T1/24

Abstract:
A detector assembly is provided that includes a semiconductor detector, a collimator, and a processing unit. The semiconductor detector has a first surface and a second surface opposed to each other. The first surface includes pixelated anodes, and the second surface includes a cathode electrode. The collimator includes openings defined by septa. The collimator defines a pitch D between adjacent septa, with the septa defining a septa length L. A ratio of L/D is less than 14. The processing unit is configured to identify detected events within virtual sub-pixels distributed along a length and width of the semiconductor detector. Each pixel comprises a plurality of corresponding virtual sub-pixels, and absorbed photons are counted as events in a corresponding virtual sub-pixel.
Public/Granted literature
- US20190377096A1 SYSTEMS AND METHODS FOR IMPROVED DETECTOR ASSEMBLY SIZING Public/Granted day:2019-12-12
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