- Patent Title: Leveling agent and electroplating composition comprising the same
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Application No.: US16191464Application Date: 2018-11-15
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Publication No.: US10760174B2Publication Date: 2020-09-01
- Inventor: Min Jung Jang , Jong Cheol Yun , Wan Joong Kim , Hee Jeong Ryu , Seung Min Park
- Applicant: SOULBRAIN CO., LTD.
- Agent Jongkook Park
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@255653a
- Main IPC: C25D3/38
- IPC: C25D3/38 ; H01L21/768 ; H01L21/288 ; C07D275/03 ; C07D275/04 ; C25D7/12
Abstract:
The present invention relates to a leveling agent and electroplating composition comprising the same. When features are plated using the electroplating composition of the present invention, excellently leveled plated surfaces with minimized defects may be obtained.
Public/Granted literature
- US20190161878A1 LEVELING AGENT AND ELECTROPLATING COMPOSITION COMPRISING THE SAME Public/Granted day:2019-05-30
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