Invention Grant
- Patent Title: Electroless copper plating polydopamine nanoparticles
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Application No.: US16414453Application Date: 2019-05-16
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Publication No.: US10760162B2Publication Date: 2020-09-01
- Inventor: Siyuan Ma , Liang Liu , Vadim Bromberg , Timothy Singler
- Applicant: The Research Foundation for the State University of New York
- Applicant Address: US NY Binghamton
- Assignee: The Research Foundation for The State University of New York
- Current Assignee: The Research Foundation for The State University of New York
- Current Assignee Address: US NY Binghamton
- Agency: Hoffberg & Associates
- Agent Steven M. Hoffberg
- Main IPC: C09D11/10
- IPC: C09D11/10 ; C23C18/16 ; C23C18/18 ; C23C18/20 ; C23C18/40 ; C23C18/44 ; H05K3/18 ; C09D11/322 ; B41M3/00 ; C23C18/31 ; H05K1/03 ; H05K1/09 ; H05K3/12

Abstract:
Aqueous dispersions of artificially synthesized, mussel-inspired polydopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 μm in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
Public/Granted literature
- US20200157684A1 ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES Public/Granted day:2020-05-21
Information query
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