Invention Grant
- Patent Title: Abrasive, abrasive set, and method for polishing substrate
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Application No.: US16018279Application Date: 2018-06-26
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Publication No.: US10759968B2Publication Date: 2020-09-01
- Inventor: Hisataka Minami , Tomohiro Iwano , Toshiaki Akutsu
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@60538108
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/3105 ; C09K3/14 ; H01L21/762 ; B24B37/04

Abstract:
A polishing agent comprises: a fluid medium; an abrasive grain containing a hydroxide of a tetravalent metal element; a first additive; a second additive; and a third additive, wherein: the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer; the second additive is a cationic polymer; and the third additive is an amino group-containing sulfonic acid compound.
Public/Granted literature
- US20180320024A1 ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE Public/Granted day:2018-11-08
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