Invention Grant
- Patent Title: Rigid substrate, touch panel, and processing method of rigid substrate
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Application No.: US14727813Application Date: 2015-06-01
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Publication No.: US10759694B2Publication Date: 2020-09-01
- Inventor: Chia-Huang Lee , Ming-Kung Wu , Heng-Chia Kuo
- Applicant: TPK Holding Co., Ltd.
- Applicant Address: KY Grand Cayman
- Assignee: TPK Holding Co., Ltd.
- Current Assignee: TPK Holding Co., Ltd.
- Current Assignee Address: KY Grand Cayman
- Agency: Cooper Legal Group, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@18729a85
- Main IPC: C03C21/00
- IPC: C03C21/00 ; H01H9/02 ; H01H11/00 ; G06F3/044 ; C03C15/02 ; C03C15/00 ; C03C19/00 ; G06F3/047 ; G09G5/00

Abstract:
A rigid substrate, a touch panel including the rigid substrate and a processing method of the rigid substrate are provided. The rigid substrate includes an ion strengthened surface layer completely covering the entire outer surface thereof. The rigid substrate has an etched wall, wherein an average depth of the ion strengthened surface layer on the etched wall is substantially equivalent to an average depth of the ion strengthened surface layer outside of the etched wall.
Public/Granted literature
- US20180134616A9 RIGID SUBSTRATE, TOUCH PANEL, AND PROCESSING METHOD OF RIGID SUBSTRATE Public/Granted day:2018-05-17
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