Invention Grant
- Patent Title: Multilayer pouch with heat-shrinkable layer
-
Application No.: US16078843Application Date: 2016-02-24
-
Publication No.: US10759578B2Publication Date: 2020-09-01
- Inventor: Peter M. Chen , Xiangke Shi , Jay D. Hodson , Seamus A. Wedge , Curtis R. Barr
- Applicant: Bemis Company, Inc.
- Applicant Address: US WI Neenah
- Assignee: Bemis Company, Inc.
- Current Assignee: Bemis Company, Inc.
- Current Assignee Address: US WI Neenah
- Agent Lynn M. Nett
- International Application: PCT/US2016/019380 WO 20160224
- International Announcement: WO2017/146698 WO 20170831
- Main IPC: B65D75/26
- IPC: B65D75/26 ; B32B7/02 ; B65D75/58 ; B65D75/00

Abstract:
A multilayer pouch with heat-shrinkable layer is described. The pouch comprises a first wall; a second wall; a perimeter comprising a first edge and a second edge opposing the first edge; and a product space positioned between the first wall, the second wall, and the perimeter. The pouch is configured to fully enclose the product space. The first wall comprises a first wall first layer having a machine direction shrinkage value of greater than 5% shrink at 90° C., a first wall second layer having a machine direction Gurley stiffness force of at least 800 mgf and a machine direction shrinkage value at 90° C. of less than the machine direction shrinkage value of the first wall first layer at 90° C., a first wall pattern connection, and a first wall air inlet. The first wall first layer is interior the first wall second layer. Various embodiments of the pouch are also described.
Public/Granted literature
- US20190352069A1 MULTILAYER POUCH WITH HEAT-SHRINKABLE LAYER Public/Granted day:2019-11-21
Information query