Invention Grant
- Patent Title: Method for three-dimensionally shaping resin packaging member, and resin packaging member
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Application No.: US16064119Application Date: 2016-12-08
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Publication No.: US10759134B2Publication Date: 2020-09-01
- Inventor: Takahiro Yasuumi , Madoka Yamaguchi , Yasushi Hatano , Kouji Kuriyama
- Applicant: Toyo Seikan Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: TOYO SEIKAN CO., LTD.
- Current Assignee: TOYO SEIKAN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4cf124a8
- International Application: PCT/JP2016/086494 WO 20161208
- International Announcement: WO2017/119231 WO 20170713
- Main IPC: B31B70/00
- IPC: B31B70/00 ; B29C43/00 ; B29C59/00 ; B31F1/00 ; B32B7/00 ; B32B27/00 ; B65D1/00 ; B65D33/00 ; B65D65/00 ; B31B70/88 ; B31F1/07 ; B65D65/40 ; B31B70/74 ; B29C59/02 ; B29C43/46 ; B29C59/04 ; B29C43/52 ; B32B7/12 ; B32B27/08 ; B32B27/36 ; B65D1/28 ; B65D33/16
Abstract:
A method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a three-dimensionally shaped portion with a large protrusion.
Public/Granted literature
- US20180370174A1 METHOD FOR THREE-DIMENSIONALLY SHAPING RESIN PACKAGING MEMBER, AND RESIN PACKAGING MEMBER Public/Granted day:2018-12-27
Information query
