According to one embodiment, an electronic apparatus includes a first casing, a second casing, and a sub-assembly. The sub-assembly includes a board, a component, and an integrally molded component. The board is positioned between the first casing and the second casing, and includes a first face, a second face opposite to the first face, and an outer rim between the first face and the second face. The component is mounted at least one of the first face and the second face. The integrally molded component consists essentially of an elastomer, and is in a state integrated with the board while sandwiching the board, and sandwiched between the first casing and the second casing.