- Patent Title: Method for producing frame-equipped vapor deposition mask, stretching apparatus, apparatus for producing organic semiconductor device and method for producing organic semiconductor device
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Application No.: US16021561Application Date: 2018-06-28
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Publication No.: US10741764B2Publication Date: 2020-08-11
- Inventor: Katsunari Obata , Toshihiko Takeda , Yoshiyuki Honma , Hideyuki Okamoto
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Shinjuku-Ku
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Shinjuku-Ku
- Agency: Burr & Brown, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2554f3d7 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@ff815aa com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46f12062
- Main IPC: C23C14/04
- IPC: C23C14/04 ; H01L51/00 ; C23C14/24 ; H01L51/50 ; H01L27/32 ; H01L51/52 ; H01L51/56

Abstract:
A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.
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