Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16273534Application Date: 2019-02-12
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Publication No.: US10741699B2Publication Date: 2020-08-11
- Inventor: Taiji Ema , Makoto Yasuda
- Applicant: UNITED SEMICONDUCTOR JAPAN CO., LTD.
- Applicant Address: JP Kuwana-shi, Mie
- Assignee: UNITED SEMICONDUCTOR JAPAN CO., LTD.
- Current Assignee: UNITED SEMICONDUCTOR JAPAN CO., LTD.
- Current Assignee Address: JP Kuwana-shi, Mie
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@39615098
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L27/06

Abstract:
A semiconductor device includes a gate insulator layer above a semiconductor substrate, a gate electrode above the gate insulating layer, a sidewall insulator layer on sidewalls of the gate electrode and above the substrate, source and drain regions within the substrate on both sides of the gate electrode, a first region within the substrate below a part of the sidewall insulator layer closer to the source region and having an impurity concentration lower than the source region, a second region provided within the substrate below a part of the sidewall insulator layer closer to the drain region and having an impurity concentration lower than the drain region, a channel region provided within the substrate between the first and second regions, and a third region within the substrate below the channel region and including impurities of a different type and having an impurity concentration higher than the channel region.
Public/Granted literature
- US20190363195A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-11-28
Information query
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