- Patent Title: High electron mobility transistor and method for forming the same
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Application No.: US16195309Application Date: 2018-11-19
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Publication No.: US10741666B2Publication Date: 2020-08-11
- Inventor: Cheng-Wei Chou , Hsin-Chih Lin
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L23/552 ; H01L29/40 ; H01L29/205 ; H01L29/778 ; H01L29/417 ; H01L29/20 ; H01L21/3213

Abstract:
A method for forming a high electron mobility transistor (HEMT) includes forming a buffer layer on a transparent substrate. The method further includes forming a barrier layer on the buffer layer. A channel region is formed in the buffer layer adjacent to the interface between the buffer layer and the barrier layer. The method further includes forming a dielectric layer on the barrier layer. The method further includes forming source/drain electrodes through the dielectric layer and the barrier layer and disposed on the buffer layer. The method further includes forming a shielding layer conformally covering the dielectric layer and the source/drain electrodes. The method further includes performing a thermal process on the source/drain electrodes.
Public/Granted literature
- US20200161447A1 HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME Public/Granted day:2020-05-21
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