Invention Grant
- Patent Title: Oxygen inserted Si-layers for reduced substrate dopant outdiffusion in power devices
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Application No.: US16058593Application Date: 2018-08-08
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Publication No.: US10741638B2Publication Date: 2020-08-11
- Inventor: Martin Poelzl , Robert Haase , Maximilian Roesch , Sylvain Leomant , Andreas Meiser , Bernhard Goller , Ravi Keshav Joshi
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/417 ; H01L27/06 ; H01L21/225 ; H01L29/40 ; H01L29/66 ; H01L21/02 ; H01L29/10 ; H01L29/739

Abstract:
A semiconductor device includes a doped Si base substrate, one or more device epitaxial layers formed over a main surface of the doped Si base substrate, a diffusion barrier structure, and a gate formed above the diffusion barrier structure. The diffusion barrier structure includes alternating layers of Si and oxygen-doped Si formed in an upper part of the doped Si base substrate adjacent the main surface of the doped Si base substrate, in a lower part of the one or more device epitaxial layers adjacent the main surface of the doped Si base substrate, or in one or more additional epitaxial layers disposed between the main surface of the doped Si base substrate and the one or more device epitaxial layers.
Public/Granted literature
- US20200052066A1 Oxygen Inserted Si-Layers for Reduced Substrate Dopant Outdiffusion in Power Devices Public/Granted day:2020-02-13
Information query
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