A semiconductor memory device comprises: a substrate; a first conductive layer and a second conductive layer arranged in a first direction crossing a surface of the substrate and extending in a second direction crossing the first direction, the first conductive layer being closer to the substrate than the second conductive layer, a length in the second direction of the first conductive layer being greater than the length of the second conductive layer; a first semiconductor film extending in the first direction and facing the first and second conductive layers; a second semiconductor film interposed between ends of the first and second conductive layers, extending in the first direction, and facing the first conductive layer; a first wiring farther from the substrate than the first semiconductor film and being electrically connected to the first semiconductor film; and a second wiring farther from the substrate than the second semiconductor film and being electrically connected to the second semiconductor film.