Invention Grant
- Patent Title: Method and device for embedding flash memory and logic integration in FinFET technology
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Application No.: US16040105Application Date: 2018-07-19
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Publication No.: US10741552B2Publication Date: 2020-08-11
- Inventor: Ming Zhu , Pinghui Li , Su Yi Susan Yeow , Yiang Aun Nga , Danny Pak-Chum Shum , Eng Huat Toh
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDERS SINGAPORE PTE. LTD.
- Current Assignee: GLOBALFOUNDERS SINGAPORE PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Ditthavong & Steiner P.C.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/02 ; H01L29/06 ; H01L27/11536

Abstract:
Methods for preventing step-height difference of flash and logic gates in FinFET devices and related devices are provided. Embodiments include forming fins in flash and logic regions; recessing an oxide exposing an upper portion of the fins; forming an oxide liner over the upper portion in the flash region; forming a polysilicon gate over and perpendicular to the fins in both regions; removing the gate from the logic region and patterning the gate in the flash region forming a separate gate over each fin; forming an ONO layer over the gates in the flash region; forming a second polysilicon gate over and perpendicular to the fins in both regions; planarizing the second polysilicon gate exposing a portion of the ONO layer over the gates in the flash region; forming and patterning a hardmask, exposing STI regions between the flash and logic regions; and forming an ILD over the STI regions.
Public/Granted literature
- US20180374850A1 METHOD AND DEVICE FOR EMBEDDING FLASH MEMORY AND LOGIC INTEGRATION IN FINFET TECHNOLOGY Public/Granted day:2018-12-27
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