Invention Grant
- Patent Title: Systems of applying materials to components
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Application No.: US16114687Application Date: 2018-08-28
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Publication No.: US10741519B2Publication Date: 2020-08-11
- Inventor: Jason L. Strader , Michael S. Wladyka , Keith David Johnson , Jingting Yang , Kevin Joel Bohrer , Mark D. Kittel
- Applicant: Laird Technologies, Inc.
- Applicant Address: US MO Chesterfield
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Chesterfield
- Agency: Harness, Dickey & Pierce, P.L.C.
- Agent Anthony G. Fussner
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/67 ; H01L23/552 ; H01L23/373 ; H01L23/367 ; B32B38/00 ; B32B38/06 ; B32B37/00 ; H01L21/48 ; B23P15/26 ; H01L21/683 ; H01L31/0203 ; B23P15/20
Abstract:
A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.
Public/Granted literature
- US20190013291A1 Systems And Methods Of Applying Thermal Interface Materials Public/Granted day:2019-01-10
Information query
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