Invention Grant
- Patent Title: Fabrication of solder balls with injection molded solder
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Application No.: US16675673Application Date: 2019-11-06
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Publication No.: US10741514B2Publication Date: 2020-08-11
- Inventor: Toyohiro Aoki , Takashi Hisada , Eiji I. Nakamura
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31
Abstract:
Wafers include a contact pad on a surface of a bulk redistribution layer. A final redistribution layer is formed on the surface and in contact with the contact pad. Solder is formed on the contact pad. The solder includes a pedestal portion formed to a same height as the final redistribution layer and a ball portion above the pedestal portion.
Public/Granted literature
- US20200075522A1 FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER Public/Granted day:2020-03-05
Information query
IPC分类:
