Invention Grant
- Patent Title: Heat conductive sheet and method of producing same, and heat dissipation device
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Application No.: US16078237Application Date: 2017-02-17
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Publication No.: US10741470B2Publication Date: 2020-08-11
- Inventor: Toyokazu Ito , Hiromi Kitagawa , Gen Kobayashi
- Applicant: ZEON CORPORATION
- Applicant Address: JP Chiyoda-ku Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Chiyoda-ku Tokyo
- Agency: Kenja IP Law PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@626b640f
- International Application: PCT/JP2017/006014 WO 20170217
- International Announcement: WO2017/145957 WO 20170831
- Main IPC: C08L27/12
- IPC: C08L27/12 ; C08K3/04 ; H01L23/373 ; H01L23/36 ; B32B27/08 ; H05K7/20 ; C08L101/00 ; H01L23/367 ; C08L27/16 ; C08L27/18 ; C08L27/14 ; C08L27/20
Abstract:
Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having a thermal resistance value under a pressure of 0.05 MPa of 0.20° C./W or less, a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator, and a method of producing a heat conductive sheet.
Public/Granted literature
- US20190244875A1 HEAT CONDUCTIVE SHEET AND METHOD OF PRODUCING SAME, AND HEAT DISSIPATION DEVICE Public/Granted day:2019-08-08
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