Invention Grant
- Patent Title: Semiconductor manufacturing apparatus
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Application No.: US15901094Application Date: 2018-02-21
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Publication No.: US10741421B2Publication Date: 2020-08-11
- Inventor: Takanori Fukusumi , Yukinobu Miyamoto
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Manto-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Manto-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3ca81957
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F27D19/00 ; G05D23/19 ; F27D17/00

Abstract:
According to an embodiment, a semiconductor manufacturing apparatus includes a holder configured to hold a processing object, a heater provided at the holder and configured to heat the processing object, a first exhaust port provided above the holder and facing the holder, and an exhaust duct. The exhaust duct is provided on an outer side surface of the first exhaust port and includes an extension and contraction function.
Public/Granted literature
- US20190074200A1 SEMICONDUCTOR MANUFACTURING APPARATUS Public/Granted day:2019-03-07
Information query
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