Invention Grant
- Patent Title: Semiconductor manufacturing apparatus
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Application No.: US16264884Application Date: 2019-02-01
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Publication No.: US10741369B2Publication Date: 2020-08-11
- Inventor: Ryo Suemitsu
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A semiconductor manufacturing apparatus according to an embodiment comprises a chamber capable of containing a substrate therein. A mount part can have the substrate mounted thereon. A first member is provided between an inner wall of the chamber and a plasma generation region above the mount part. An optical transmitter is provided in an opening that is provided in the first member to extend from a side of the inner wall of the chamber to the plasma generation region or provided in gaps between a plurality of the first members.
Public/Granted literature
- US20190164732A1 SEMICONDUCTOR MANUFACTURING APPARATUS Public/Granted day:2019-05-30
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