- Patent Title: Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor
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Application No.: US16157568Application Date: 2018-10-11
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Publication No.: US10741322B2Publication Date: 2020-08-11
- Inventor: Kevin O'Brien , Bryce Cole , Robert Jacob Kramer
- Applicant: The Diller Corporation
- Applicant Address: US OH Cincinnati
- Assignee: THE DILLER CORPORATION
- Current Assignee: THE DILLER CORPORATION
- Current Assignee Address: US OH Cincinnati
- Agency: Ice Miller LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F38/14 ; B32B29/00 ; H01F5/00 ; B32B3/08 ; B32B27/40 ; B32B27/42 ; B32B27/36 ; B32B27/30 ; B32B3/26 ; B32B7/04 ; B32B27/10 ; H01F27/24 ; H01F41/04 ; H02J5/00 ; H02J7/00 ; H02J7/02

Abstract:
Decorative, multi-layer surfacing materials, surfaces made therewith, methods of making such and wireless power transmission using the same, which surfacing materials comprise: a first resin-impregnated paper layer and a second resin-impregnated paper layer, and a first conductive material having a first terminus and a second terminus and capable of carrying an electric current from the first terminus to the second terminus; wherein the first conductive material is disposed on a first surface of the first resin-impregnated paper layer; wherein the first resin-impregnated paper layer and the second resin-impregnated paper layer are disposed in a stacked and compressed such that the first conductive material is encapsulated between the first resin-impregnated paper layer and the second resin-impregnated paper layer; and wherein at least one of the first resin-impregnated paper layer, the second resin-impregnated paper layer or an optional additional resin-impregnated paper layer is a decorative layer.
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