Invention Grant
- Patent Title: Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides
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Application No.: US15752606Application Date: 2015-10-08
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Publication No.: US10738388B2Publication Date: 2020-08-11
- Inventor: Weijing Lu , Lingli Duan , Zukhra Niazimbetova , Chen Chen , Maria Rzeznik
- Applicant: Dow Global Technologies LLC , Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough US MI Midland
- Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee Address: US MA Marlborough US MI Midland
- Agent John J. Piskorski
- International Application: PCT/CN2015/091431 WO 20151008
- International Announcement: WO2017/059562 WO 20170413
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D3/58 ; C25D3/60 ; C25D7/12 ; C23C18/16
Abstract:
Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Public/Granted literature
- US20180237929A1 COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND POLYACRYLAMIDES Public/Granted day:2018-08-23
Information query
