Invention Grant
- Patent Title: Metal plating compositions
-
Application No.: US15559574Application Date: 2015-04-28
-
Publication No.: US10738039B2Publication Date: 2020-08-11
- Inventor: Lingli Duan , Chen Chen , Shaoguang Feng , Zukhra I. Niazimbetova , Maria Anna Rzeznik
- Applicant: Dow Global Technologies LLC , Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough US MI Midland
- Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee Address: US MA Marlborough US MI Midland
- Agent John J. Piskorski
- International Application: PCT/CN2015/077684 WO 20150428
- International Announcement: WO2016/172853 WO 20161103
- Main IPC: C07D413/12
- IPC: C07D413/12 ; C25D3/38 ; C07D241/04 ; C07D265/33 ; C07D413/06 ; C07D413/10 ; C25D3/30

Abstract:
Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
Public/Granted literature
- US20180051014A1 NEW METAL PLATING COMPOSITIONS Public/Granted day:2018-02-22
Information query