Invention Grant
- Patent Title: Sector level sweep for millimeter-wave multiple output communications
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Application No.: US16002745Application Date: 2018-06-07
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Publication No.: US10736098B2Publication Date: 2020-08-04
- Inventor: Alexander Alexandrovich Maltsev , Artyom Lomayev , Carlos Cordeiro , Assaf Kasher
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04W72/04
- IPC: H04W72/04 ; H04B7/0452 ; H04B7/0408 ; H04B7/0491 ; H04B7/06 ; H04B7/08

Abstract:
Generally discussed herein are devices and methods for MIMO communications. A device can include processing circuitry (e.g., PHY and/or MAC layer circuitry) configured to transmit an enhanced sector sweep (ESSW) frame for each of a plurality of transmit sectors, wherein each of the plurality of transmit sectors correspond to a weight vector for the first plurality of antennas, each ESSW frame including a plurality of training units to simultaneously beamforming train one or more responder STAs, receive an SSW feedback frame, each SSW feedback frame indicating a transmit sector of the plurality of transmit sectors and a receive sector of a corresponding STA of the one or more STAs to be used in communication between the initiator STA and the responder STA, and transmit one or more SSW acknowledgement frames to the one or more responder STAs to verify the transmit sector and receive sector to use for communication.
Public/Granted literature
- US20190045504A1 SECTOR LEVEL SWEEP FOR MILLIMETER-WAVE MULTIPLE OUTPUT COMMUNICATIONS Public/Granted day:2019-02-07
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