Invention Grant
- Patent Title: Receiver optical module and process of assembling the same
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Application No.: US16171538Application Date: 2018-10-26
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Publication No.: US10734369B2Publication Date: 2020-08-04
- Inventor: Kyohei Maekawa
- Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Applicant Address: JP Yokohama-shi
- Assignee: Sumitomo Electric Device Innovations, Inc.
- Current Assignee: Sumitomo Electric Device Innovations, Inc.
- Current Assignee Address: JP Yokohama-shi
- Agency: Baker Botts L.L.P.
- Agent Michael A. Sartori
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5f764575 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4fd493e8
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L31/02 ; H01L23/00 ; H01L31/0232 ; G02B6/42 ; H01L31/0203

Abstract:
A receiver optical module that receives an optical signal and generating an electrical signal corresponding to the optical signal is disclosed. The module includes a photodiode (PD), a sub-mount, a pre-amplifier, and a stem. The sub-mount, which is made of insulating material, mounts the PD thereon. The pre-amplifier, which receives the photocurrent generated by the PD, mounts the PD through the sub-mount with an adhesive. The pre-amplifier generates an electrical signal corresponding to the photocurrent and has signal pads and other pads. The stem, which mounts the pre-amplifier, provides lead terminals wire-bonded with the signal pads of the pre-amplifier. The signal pads make distances against the sub-mount that are greater than distances from the other pads to the sub-mount.
Public/Granted literature
- US20190131288A1 RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME Public/Granted day:2019-05-02
Information query
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