Invention Grant
- Patent Title: Chip structure
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Application No.: US16030864Application Date: 2018-07-10
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Publication No.: US10734344B2Publication Date: 2020-08-04
- Inventor: Ling-Chieh Li , Chiao-Ling Huang
- Applicant: Novatek Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: Novatek Microelectronics Corp.
- Current Assignee: Novatek Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00
Abstract:
A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.
Public/Granted literature
- US20190198473A1 CHIP STRUCTURE Public/Granted day:2019-06-27
Information query
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