Invention Grant
- Patent Title: Small-diameter insulated wire
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Application No.: US16633876Application Date: 2018-04-27
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Publication No.: US10734135B2Publication Date: 2020-08-04
- Inventor: Kenji Hori
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@33e0c78c
- International Application: PCT/JP2018/017269 WO 20180427
- International Announcement: WO2019/021563 WO 20190131
- Main IPC: H01B7/04
- IPC: H01B7/04 ; H01B3/44 ; H01B7/02

Abstract:
A small-diameter insulated wire has a small diameter and high bending resistance. In a small-diameter insulated wire having a conductor and an insulating layer covering the conductor, a cross-sectional area of the conductor is 0.08 mm2 or more and 0.4 mm2 or less, the conductor is a copper alloy having a breaking strength of 815 MPa or more, a breaking strength of the insulating layer is 36.5 MPa or more, a thickness of the insulating layer is 0.1 mm or more and 0.2 mm or less, and a conductor pullout force for drawing the conductor from the small-diameter insulated wire is 9 N/30 mm or less.
Public/Granted literature
- US20200176148A1 SMALL-DIAMETER INSULATED WIRE Public/Granted day:2020-06-04
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