Invention Grant
- Patent Title: Semiconductor sensor device and method for manufacturing same
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Application No.: US15764631Application Date: 2016-08-03
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Publication No.: US10732062B2Publication Date: 2020-08-04
- Inventor: Takeshi Konno , Hiroshi Kikuchi , Kentarou Miyajima , Munenori Degawa
- Applicant: Hitachi Automotive Systems, Ltd.
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Crowell & Moring LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2a17a9aa
- International Application: PCT/JP2016/072714 WO 20160803
- International Announcement: WO2017/056698 WO 20170406
- Main IPC: G01L19/00
- IPC: G01L19/00 ; G01L19/04 ; H01L21/58 ; H01L23/00 ; G01L9/00 ; G01L19/14
Abstract:
To provide a high-performance semiconductor sensor device and a method for manufacturing the semiconductor sensor device. This semiconductor sensor device has a sensor chip, and a first thin film formed on the sensor chip, said sensor chip being mechanically connected, via the first thin film, to a second thin film formed on a base formed of a polycrystalline material.
Public/Granted literature
- US20180274999A1 Semiconductor Sensor Device and Method for Manufacturing Same Public/Granted day:2018-09-27
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