Invention Grant
- Patent Title: Low cost overmolded leadframe force sensor with multiple mounting positions
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Application No.: US16192727Application Date: 2018-11-15
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Publication No.: US10732057B2Publication Date: 2020-08-04
- Inventor: Josh M. Fribley , Lamar Floyd Ricks , Richard Wade , Jim Machir , Richard Alan Davis
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Seager, Tufte & Wickhem, LLP
- Main IPC: G01L1/18
- IPC: G01L1/18 ; B81B7/00 ; B81C1/00

Abstract:
A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.
Public/Granted literature
- US20190101461A1 LOW COST OVERMOLDED LEADFRAME FORCE SENSOR WITH MULTIPLE MOUNTING POSITIONS Public/Granted day:2019-04-04
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