Invention Grant
- Patent Title: Integrated circuit and method of testing
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Application No.: US15693848Application Date: 2017-09-01
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Publication No.: US10707853B2Publication Date: 2020-07-07
- Inventor: Jinn-Yeh Chien
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H03K5/26
- IPC: H03K5/26 ; G01R31/317

Abstract:
An integrated circuit for testing a circuit includes a controller configured to select a loopback path of the circuit. The circuit includes a data path and an inverter, and each is electrically coupled to the selected loopback path. The integrated circuit includes a counter electrically coupled to the selected loopback path. The circuit is configured to receive a first voltage signal that is either a substantially low logic level signal or a substantially high logic level signal. The circuit is configured to generate an oscillating signal from the first voltage signal, and the counter is configured to count oscillations of the oscillating signal.
Public/Granted literature
- US20170366177A1 INTEGRATED CIRCUIT AND METHOD OF TESTING Public/Granted day:2017-12-21
Information query
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