A piezoelectric oscillation device includes a piezoelectric vibration element, a heating element that heats the piezoelectric vibration element, an electronic component that is electrically connected to the piezoelectric vibration element, a substrate on which the piezoelectric vibrator, the heating element, and the electronic component are mounted, and a base member to which the substrate is attached with a prescribed spacing therebetween via a substrate holding member. The substrate holding member includes a conductive part. The conductive part has a lower thermal conductivity than metal.