- Patent Title: Method for providing a wire connection to a printed circuit board
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Application No.: US15816208Application Date: 2017-11-17
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Publication No.: US10707635B2Publication Date: 2020-07-07
- Inventor: Eden Dubuc , Hubert Cardinal
- Applicant: CURRENT LIGHTING SOLUTIONS, LLC
- Applicant Address: US OH East Cleveland
- Assignee: CURRENT LIGHTING SOLUTIONS, LLC
- Current Assignee: CURRENT LIGHTING SOLUTIONS, LLC
- Current Assignee Address: US OH East Cleveland
- Agency: Buckley, Maschoff & Talwalkar LLC
- Main IPC: H01R43/20
- IPC: H01R43/20 ; H01L25/075 ; H01R43/048 ; H01R4/18 ; H05K3/28 ; H05K3/32

Abstract:
Provided is a method for providing a wire connection to a printed circuit board. The method includes attaching a first end of a wire at a first location on the printed circuit board and attaching a second end of the wire at a second location of the printed circuit board, to form an arched wire. The method further includes applying an encapsulant on the printed circuit board, the encapsulant forming a film through which the arched wire protrudes. Furthermore, the method includes cutting the arched wire to yield an out-of-plane wire connected to the printed circuit board.
Public/Granted literature
- US20180331484A1 METHOD FOR PROVIDING A WIRE CONNECTION TO A PRINTED CIRCUIT BOARD Public/Granted day:2018-11-15
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