Invention Grant
- Patent Title: Module board socket connector
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Application No.: US15773862Application Date: 2015-12-22
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Publication No.: US10707602B2Publication Date: 2020-07-07
- Inventor: Kevin B. Leigh , Sunil Ganta , John Norton
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Brooks, Cameron & Huebsch, PLLC
- International Application: PCT/US2015/067421 WO 20151222
- International Announcement: WO2017/111951 WO 20170629
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R13/64 ; H01R33/76 ; H01R12/71 ; H01R13/621 ; H01R24/00

Abstract:
In one example, a system for a socket connector includes a first alignment feature with a first height to engage with a module board, wherein the first alignment feature horizontally aligns the module board with a socket, and a second alignment feature with a second height to engage with the module board, wherein the second alignment feature vertically aligns the module board with the socket.
Public/Granted literature
- US20190157783A1 SOCKET CONNECTOR Public/Granted day:2019-05-23
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