A conductive terminal is adapted to electrically connect a wire to a circuit board. The circuit board has a through hole and solder pads on a surface of the circuit board. The conductive terminal comprises a base, a pair of mounting portions, and a pair of clamping portions. The base has a pair of opposing first edges, a pair of opposing second edges, and an insertion hole aligned with the through hole of the circuit board. The mounting portions include a pair of solder portions extending outwardly from the first edges and parallel to the base. The solder portions are each adapted to be soldered to one of the solder pads of the circuit board. The clamping portions extend obliquely toward each other from the two second edges of the base and are adapted to clamp a conductor of the wire inserted through the insertion hole and the through hole.