Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16316082Application Date: 2017-06-26
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Publication No.: US10707341B2Publication Date: 2020-07-07
- Inventor: Yukiyasu Nakao , Kohei Ebihara , Shiro Hino
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4a15e21b
- International Application: PCT/JP2017/023349 WO 20170626
- International Announcement: WO2018/037701 WO 20180301
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/47 ; H01L29/16

Abstract:
A semiconductor device includes: a plurality of semiconductor switching elements that are a plurality of MOSFETs each including a Schottky barrier diode; a first ohmic electrode disposed above a first region of a well region and electrically connected to the first region, the first region being on the opposite side from a predefined region; a first Schottky electrode disposed on a semiconductor layer exposed at the first region of the well region; and a line electrically connected to the first ohmic electrode, the first Schottky electrode, and a source electrode. The device enables reduction of a breakdown in a gate insulating film.
Public/Granted literature
- US20200185517A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-06-11
Information query
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