Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US16284162Application Date: 2019-02-25
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Publication No.: US10707338B2Publication Date: 2020-07-07
- Inventor: Atsushi Yamada , Junji Kotani
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2361eb64
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L31/0256 ; H01L29/778 ; H01L29/66 ; H01L29/04

Abstract:
A semiconductor device includes a substrate; a first barrier layer containing AlN, over the substrate; a channel layer containing BGaN, over the first barrier layer; and a second barrier layer containing AlN, over the channel layer. A difference between a first lattice constant of the channel layer and a second lattice constant of the first barrier layer is less than or equal to 1.55% of the second lattice constant.
Public/Granted literature
- US20190296137A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-09-26
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