Invention Grant
- Patent Title: FinFET with epitaxial source and drain regions and dielectric isolated channel region
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Application No.: US16030359Application Date: 2018-07-09
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Publication No.: US10707332B2Publication Date: 2020-07-07
- Inventor: Kangguo Cheng , Ramachandra Divakaruni , Ali Khakifirooz , Alexander Reznicek , Soon-Cheon Seo
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Alvin Borromeo
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/10 ; H01L29/165 ; H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/16 ; H01L29/161

Abstract:
A semiconductor device is provided that includes a pedestal of an insulating material present over at least one layer of a semiconductor material, and at least one fin structure in contact with the pedestal of the insulating material. Source and drain region structures are present on opposing sides of the at least one fin structure. At least one of the source and drain region structures includes at least two epitaxial material layers. A first epitaxial material layer is in contact with the at least one layer of semiconductor material. A second epitaxial material layer is in contact with the at least one fin structure. The first epitaxial material layer is separated from the at least one fin structure by the second epitaxial material layer. A gate structure present on the at least one fin structure.
Public/Granted literature
- US20180323288A1 FINFET WITH EPITAXIAL SOURCE AND DRAIN REGIONS AND DIELECTRIC ISOLATED CHANNEL REGION Public/Granted day:2018-11-08
Information query
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